Park member Pragmatic Semiconductor has reached a major milestone, announcing that its flexible NFC chip technology is now being used at mass scale through a partnership with global materials and digital identification company Avery Dennison.
The collaboration marks the first time Pragmatic’s ultra-thin, flexible chips have been integrated into millions of NFC-enabled labels and packaging components. The technology allows products to be tapped with a smartphone, enabling features such as digital content, product authentication and regulatory compliance.
Unlike traditional silicon chips, Pragmatic’s flexible integrated circuits can bend and conform to curved products or packaging, making them suitable for use across a wide range of sectors. The chips are also produced using a more sustainable manufacturing process, using less energy and water, and fewer harmful chemicals.
By incorporating Pragmatic’s technology into its NFC inlay portfolio, Avery Dennison is helping to make connected packaging more affordable, scalable and sustainable, supporting growing demand for smarter, more interactive products worldwide.